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Telink Semiconductor Showcases at IOTE 2025 Shenzhen IoT Expo

The Internet of Things (IoT) has entered a new phase characterized by technological innovation and the deep expansion of application scenarios. Despite ongoing challenges such as enhanced data security and cross-platform compatibility, continuous breakthroughs in wireless technology and collaborative industry ecosystem development are steadily expanding the boundaries of IoT applications, injecting robust momentum into industry growth.

From August 27 to 29, 2025, the 24th International Internet of Things Exhibition (IOTE 2025) was grandly held at the Shenzhen World Exhibition & Convention Center in Bao'an. Telink Semiconductor, a global leader in IoT wireless connectivity chips, showcased its full range of products and solutions at the event. Its T&TLSR series SoCs and various high-performance modules have been widely adopted in smart home, wearable, wireless audio, and other applications. On site, Telink highlighted its diverse innovations in cutting-edge IoT applications, including Bluetooth Channel Sensing, Bluetooth Classic & 2.4GHz Dual-Mode Online Mixing, Auracast Broadcast Audio, Matter, Ultra-Low Latency Game Controller Solutions, and Edge AI-Powered Smart Noise Cancellation.

Particularly noteworthy were Telink’s three newly launched next-generation modules—the ML7218X series (ML7218A and ML7218D) and ML3219D. With their ultra-low power architecture and multi-protocol compatibility, these modules provide critical technical support for driving the miniaturization and intelligence of IoT systems.

The ML7218X series modules are highly integrated solutions designed for complex IoT scenarios, offering core advantages in three key areas:

01 Hardware Architecture

Equipped with a 32-bit RISC-V microcontroller running at up to 240 MHz and supporting DSP extended instructions, the modules are paired with 512 KB SRAM (including 256 KB retention memory) and 2 MB embedded flash memory, delivering powerful performance for complex computations.

02 Multi-Protocol Support

They offer multi-protocol compatibility, supporting Bluetooth LE, Thread, Zigbee Pro R23, and configurable 2.4 GHz proprietary wireless modes, meeting diverse needs from short-range connectivity to low-power wide-area networks.

03 Security Architecture


A comprehensive security system integrates secure boot, firmware encryption, and OTA update mechanisms. With hardware-accelerated AES/ECC/hash algorithms and RSA2048/ECC256 signature verification, combined with debug port security controls, the modules provide end-to-end data protection from development to deployment.

Supported by adaptive power management technology, the ML7218X modules deliver high performance alongside ultra-low power consumption, offering efficient and reliable IoT solutions for smart home devices, remotes, wireless HIDs, wearables, asset tracking, and more.

The ML7218X series includes two models—ML7218D and ML7218A—featuring differentiated designs in wireless performance, power efficiency, and interfaces to suit various applications (see table for details).


ML7218D1-MERCURY    ML7218A-GAIA

Wireless Performance  

RX Sensitivity  

 -96dBm @LE 1 Mbps

TX Power  

 Up to 8.5dBm, supports multiple   rates and modes    Up to 9dBm, supports   multiple rates and modes

Stable Connection   

Supports PTA, compatible with Wi-Fi coexistence

Power Consumption   

Operating Current 

2.4 mA @ Bluetooth® LE Rx 3.3 V DCDC mode    2.6 mA @ Bluetooth® LE Rx 3.3 V DCDC mode

3.5 mA @ Bluetooth® LE Rx 3.3 V DCDC mode    2.8 mA @ Bluetooth® LE Rx 3.3 V DCDC mode

Deep Sleep   

No SRAM retention: Power consumption as low as 1μA

Rich Interfaces  

GPIO  

Up to 20 General Purpose Input/Output pins    Up to 48 General Purpose Input/Output   pins

Communication Interfaces

3 SPI channels, 2 I2C interfaces      3 SPI channels, 2 I2C interfaces

3 UART interfaces (support hardware flow control and 7816 protocol)    2 UART interfaces (support hardware flow   control and asynchronous serial protocol)

USB 2.0 device interface    USB   2.0 device interface, supports JTAG/SDP/SWS interfaces for firmware download   and debugging

Audio Interfaces  

 Single-channel AMIC and   dual-channel DMIC    Dual-channel DMIC,   supports audio processing

 

The ML3219D is a multi-standard wireless module designed for IoT applications, integrating high performance, ultra-low power consumption, and full protocol support to deliver flexible and reliable connectivity solutions for smart home, wearable, and industrial control applications.

At its core, the ML3219D features a 32-bit RISC-V microcontroller running at 96 MHz with DSP extended instructions, along with 128 KB SRAM (including 96 KB retention memory) and 2 MB embedded flash memory, enabling efficient handling of complex computational tasks.

In terms of communication protocols, the module supports Bluetooth LE (LE 2M, LE Coded2), Zigbee Pro R23 (backward compatible with R22/R21 and supporting Touchlink technology), RF4CE (compliant with IEEE 802.15.4), and Thread (full IPv6/6LoWPAN and IEEE 802.15.4 network layer support), as well as configurable 2.4 GHz proprietary protocols (supporting 1Mbps/2Mbps/250kbps/500kbps rates), enabling seamless cross-ecosystem connectivity.

Wireless performance includes a receive sensitivity of -96 dBm (Bluetooth LE 1Mbps) and transmit power of +10 dBm (supporting multiple rates and modes). It also supports Bluetooth LE connection modes such as high-duty-cycle non-connectable advertising, ensuring stable communication quality.

The security system includes secure boot, root-of-trust, and secure OTA update capabilities. With hardware-accelerated AES/AES-CCM, ECC, and hash functions, along with RSA2048/ECC256 signature verification, the module provides end-to-end protection from firmware updates to data transmission, alongside debug port security controls.

Power efficiency is a highlight: operating current is just 3.5 mA in Bluetooth LE receive mode (3.3V DCDC) and 4.3 mA in transmit mode (3.3V DCDC). Deep sleep current is as low as 0.79 µA without the 32K RC oscillator and 1.09 µA with it.

The module offers extensive interfaces, including 24 GPIOs, 2 SPI/I2C interfaces, 3 UART interfaces, a USB 2.0 device interface, single-channel AMIC/DMIC audio input, and a 12-bit auxiliary ADC, meeting diverse peripheral expansion needs.

It is well-suited for smart home devices, remotes, wireless HIDs, wearables, asset tracking, and other applications, providing high energy efficiency and flexible adaptability for IoT endpoints.

At the exhibition, Telink demonstrated a range of solutions based on these wireless modules. Among them, the Matter solution—utilizing both ML7218X and ML3219D modules—is tailored for smart home and home control applications.

The Edge AI solution, built on the ML7218x module, supports AI noise reduction algorithms and frameworks such as LiteRT/TVM, enabling easy conversion of models trained on TensorFlow, PyTorch, JAX, and other platforms.

Additionally, Telink showcased a SmartTag solution based on the ML3219D module. Deeply integrated with Apple, Google, and Samsung ecosystems, it enables item-finding functionality. Users can bind a tag to their phone account to track lost items. If a tagged item moves beyond a set distance from the phone, an alert is triggered to warn the user of a potential loss, aiding timely recovery.

Telink also demonstrated an Auracast broadcast audio solution based on the ML7218x module. Auracast, a new Bluetooth feature, delivers a revolutionary audio experience—allowing users to share audio, break the silence of their surroundings, enjoy high-quality sound, and enhance interactions with others and their environment.

Telink’s solution supports LE Audio and Auracast, combining high-performance computing with low-power design. It processes the latest LC3 codec, extending battery life while supporting under 30 ms low latency and 48 kHz audio sampling.

Industry Awards
Of special note, during the IOTE Gold Award 2025 ceremony held alongside the exhibition, Telink’s ML7218X module stood out and won the Gold Award in the "Communication and Positioning Products" category. The IOTE Gold Award, a highly authoritative and credible recognition in the IoT industry, focuses on cutting-edge innovations and sets new benchmarks for the entire IoT sector.


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SHENZHEN E-MANTECH CO., LIMITED was established in 2014 with a registered capital of 10 million RMB.
Its predecessor was Shenzhen Hainengda Technology Development Co., Ltd., founded in 2005.
The company is committed to becoming the preferred trading platform for electronic components in the Chinese electronics industry.
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